Hans Low Power Lasers

When it comes to tiny marking, the finest tool available in the laser tools is the ultraviolet laser.  With its narrow beam diameter, at 355 nanometers, it is commonly used for micro-machining electronics, or laser marking parts that cannot receive heat (infrared wavelength).

The laser marking process is a pulsed process whereby each pulse removes a small amount of material, much like peeling an onion.  Albeit slow, it is the only laser capable for specific projects in electronics, micro-machining, ceramics, and other fields. 

Ultraviolet Lasers operate at the lowest wavelength for lasers, 355 nanometers, and within the UV spectrum.  When UV energy is coherent it can laser drill (mark) with each laser pulse. The UV ablation process is similar to peeling an onion. 

Unlike infrared lasers that use heat to ablate, UV lasers will not damage the surrounding area because heat is not present.  UV lasers provide the best drill, cut or mark, but are often much slower and are therefore rarely used in industrial applications.

UV lasers are the smallest diameter laser tool available on the market.